ГОСТ Р МЭК 61191-1-2017 Печатные узлы. Часть 1. Поверхностный монтаж и связанные с ним технологии. Общие технические требования

Библиография

Ссылки на IEC и ISO

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

IEC 60068-2-58:2004 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use of printed boards and printed board assemblies - Part 5-2: Attachment (land/joint) considerations - Discrete components

IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: - Attachment (land/ joint) considerations - Components with J leads on two sides

IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: - Attachment (land/ joint) considerations - Components with gull-wing leads on four sides

IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: - Attachment (land/joint) considerations - Chip carriers with J leads on four sides

IEC 61188-7:2009 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

IEC 61189-2:2006 Test methods for electrical materials, printed boards an other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

IEC 61190-1-2:2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

IEC 61193-3 Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing

IEC 62326-1:2002 Printed boards - Part 1: Generic specification

IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels А, В and С

IEC/PAS 62326-7-1:2007 Performance guide for single - and double-sided flexible printed wiring boards

ISO 9001:2008 Quality management systems - Requirements

Другие ссылки

IPC-TM-650 Test Methods Manual

2.3.25 Detection and measurement of ionizable surface contaminants by resistivity of solvent extract

2.3.25.1 Ionic Cleanliness Testing of Bare PWBs

2.3.27 Cleanliness test - residual rosin

2.3.38 Surface organic contamination detection test

2.4.22 Bow and twist (percentage)

2.6.3.3 Surface insulation resistance, fluxes

IPC-PC-90 General Requirements for Implementation of Statistical Process Control