ГОСТ Р МЭК 62878-1-1-2019 Основание со встроенными компонентами. Часть 1-1. Общие требования. Методы испытаний

Библиография

IEC 60068-1, Environmental testing - Part 1: General and guidance

IEC 60068-2-6, Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)

IEC 60068-2-14, Environmental testing - Part 2-14: Test N: Change of temperature

IEC 60068-2-20, Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

IEC 60068-2-21, Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

IEC 60068-2-30, Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

IEC 60068-2-38, Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test

IEC 60068-2-53, Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests

IEC 60068-2-58, Environmental testing - Part 2-58: Tests -Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC 60068-2-64, Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance

IEC 60068-2-66, Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)

IEC 60068-2-78, Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state

IEC 60068-2-80, Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode

IEC 61189-1, Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IEC 61189-2, Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

IEC 61189-11, Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

IEC 61190-1-2, Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC 61190-1-3, Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

IEC 62137-1-2, Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

IEC 62137-1-3, Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

IEC 62421, Electronics assembly technology - Electronic modules

IEC TR 62866, Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

IEC TS 62878-2-1, Device embedded substrate - Part 2-1: Guidelines - General description of technology

IEC TS 62878-2-3, Device embedded substrate - Part 2-3: Guidelines - Design guide

ISO 291, Plastics - Standard atmospheres for conditioning and testing

ISO 2409, Paints and varnishes - Cross-cut test

ISO 3366, Coated abrasives - Abrasive rolls

ISO 3599, Vernier callipers reading to 0,1 and 0,05 mm (withdrawn)